| https://dblp.org/rdf/schema#affiliation
|
Qualcomm Innovation Center Inc., San Diego, CA, USA
, Pennsylvania State University, USA
|
| https://dblp.org/rdf/schema#authorOf
|
https://dblp.org/rec/journals/tc/OzturkODYK17 +
, https://dblp.org/rec/conf/mascots/SharifiDGZTKD17 +
, https://dblp.org/rec/conf/cgo/SrinivasDK15 +
, https://dblp.org/rec/conf/dac/LiuKDK15 +
, https://dblp.org/rec/conf/pldi/DingTKZK15 +
, https://dblp.org/rec/conf/IEEEpact/DingKGJDY14 +
, https://dblp.org/rec/conf/iiswc/OrhanDYKO14 +
, https://dblp.org/rec/conf/mascots/KandemirDG14 +
, https://dblp.org/rec/conf/micro/DingGK14 +
, https://dblp.org/rec/conf/sigmetrics/DingK14 +
, https://dblp.org/rec/journals/sp/DingZKS13 +
, https://dblp.org/rec/conf/IEEEpact/DingLKI13 +
, https://dblp.org/rec/conf/cgo/DingZKSY13 +
, https://dblp.org/rec/conf/ppopp/LiuDJK13 +
, https://dblp.org/rec/conf/IEEEpact/DingKZK12 +
, https://dblp.org/rec/conf/dac/ZhaoJDZKI12 +
, https://dblp.org/rec/conf/iccad/DingK12 +
, https://dblp.org/rec/conf/pldi/LiuZJDK12 +
, https://dblp.org/rec/conf/sc/DingZKS12 +
, https://dblp.org/rec/conf/IEEEpact/ZhangDLK11 +
, https://dblp.org/rec/conf/IEEEpact/DingSKK11 +
, https://dblp.org/rec/conf/cgo/LiuZDK11 +
, https://dblp.org/rec/conf/iccad/DingZLK11 +
, https://dblp.org/rec/conf/iccad/ZhaoKDI11 +
, https://dblp.org/rec/conf/micro/ZhangDKLJ11 +
|
| https://dblp.org/rdf/schema#coCreatorWith
|
https://dblp.org/pid/d/ChitaRDas +
, https://dblp.org/pid/151/5387 +
, https://dblp.org/pid/i/MaryJaneIrwin +
, https://dblp.org/pid/27/10978 +
, https://dblp.org/pid/64/11467 +
, https://dblp.org/pid/k/MahmutTKandemir +
, https://dblp.org/pid/31/1251 +
, https://dblp.org/pid/135/5520 +
, https://dblp.org/pid/74/8419 +
, https://dblp.org/pid/95/3736-8 +
, https://dblp.org/pid/74/2068 +
, https://dblp.org/pid/89/1795-1 +
, https://dblp.org/pid/74/288 +
, https://dblp.org/pid/47/6171-1 +
, https://dblp.org/pid/46/2480 +
, https://dblp.org/pid/66/10956 +
, https://dblp.org/pid/24/8190 +
, https://dblp.org/pid/11/3546 +
, https://dblp.org/pid/39/6153-13 +
|
| https://dblp.org/rdf/schema#creatorName
|
Wei Ding
|
| https://dblp.org/rdf/schema#creatorOf
|
https://dblp.org/rec/journals/tc/OzturkODYK17 +
, https://dblp.org/rec/conf/mascots/SharifiDGZTKD17 +
, https://dblp.org/rec/conf/cgo/SrinivasDK15 +
, https://dblp.org/rec/conf/dac/LiuKDK15 +
, https://dblp.org/rec/conf/pldi/DingTKZK15 +
, https://dblp.org/rec/conf/IEEEpact/DingKGJDY14 +
, https://dblp.org/rec/conf/iiswc/OrhanDYKO14 +
, https://dblp.org/rec/conf/mascots/KandemirDG14 +
, https://dblp.org/rec/conf/micro/DingGK14 +
, https://dblp.org/rec/conf/sigmetrics/DingK14 +
, https://dblp.org/rec/journals/sp/DingZKS13 +
, https://dblp.org/rec/conf/IEEEpact/DingLKI13 +
, https://dblp.org/rec/conf/cgo/DingZKSY13 +
, https://dblp.org/rec/conf/ppopp/LiuDJK13 +
, https://dblp.org/rec/conf/IEEEpact/DingKZK12 +
, https://dblp.org/rec/conf/dac/ZhaoJDZKI12 +
, https://dblp.org/rec/conf/iccad/DingK12 +
, https://dblp.org/rec/conf/pldi/LiuZJDK12 +
, https://dblp.org/rec/conf/sc/DingZKS12 +
, https://dblp.org/rec/conf/IEEEpact/ZhangDLK11 +
, https://dblp.org/rec/conf/IEEEpact/DingSKK11 +
, https://dblp.org/rec/conf/cgo/LiuZDK11 +
, https://dblp.org/rec/conf/iccad/DingZLK11 +
, https://dblp.org/rec/conf/iccad/ZhaoKDI11 +
, https://dblp.org/rec/conf/micro/ZhangDKLJ11 +
|
| https://dblp.org/rdf/schema#primaryAffiliation
|
Qualcomm Innovation Center Inc., San Diego, CA, USA
|
| https://dblp.org/rdf/schema#primaryCreatorName
|
Wei Ding
|
| https://dblp.org/rdf/schema#proxyAmbiguousCreator
|
https://dblp.org/pid/59/622 +
|
| rdf:type |
https://dblp.org/rdf/schema#Creator +
, https://dblp.org/rdf/schema#Person +
|
| rdfs:label |
Wei Ding 0008
|
