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http://dbpedia.org/ontology/abstract The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. , De thin shrink small outline package (TSSOP) is een rechthoekige kunststof smd IC-behuizing. , Um Thin-Shrink Small Outline Package (ou TUm Thin-Shrink Small Outline Package (ou TSSOP) é um componente retangular de dimensões reduzidas, utilizado em montagem superficial. Um TSSOP Tipo I possui terminais emergindo dos lados mais curtos do componente, enquanto que os TSSOP Tipo II possuem terminais emergindo dos lados mais longos do componente. Um TSSOP pode ter de 8 a 56 terminais.te. Um TSSOP pode ter de 8 a 56 terminais.
http://dbpedia.org/ontology/thumbnail http://commons.wikimedia.org/wiki/Special:FilePath/TSSOP_16L.gif?width=300 +
http://dbpedia.org/ontology/wikiPageExternalLink https://jeelabs.org/book/1513c/index.html +
http://dbpedia.org/ontology/wikiPageID 66103834
http://dbpedia.org/ontology/wikiPageLength 3041
http://dbpedia.org/ontology/wikiPageRevisionID 1105298881
http://dbpedia.org/ontology/wikiPageWikiLink http://dbpedia.org/resource/Disk_drives + , http://dbpedia.org/resource/Small_Outline_Integrated_Circuit + , http://dbpedia.org/resource/Printed_circuit_board + , http://dbpedia.org/resource/Integrated_circuit + , http://dbpedia.org/resource/Category:Semiconductor_packages + , http://dbpedia.org/resource/Mini_Small_Outline_Package + , http://dbpedia.org/resource/Thin_small_outline_package + , http://dbpedia.org/resource/File:TSSOP_16L.gif + , http://dbpedia.org/resource/Texas_Instruments + , http://dbpedia.org/resource/Shrink_Small_Outline_Package + , http://dbpedia.org/resource/List_of_integrated_circuit_packaging_types + , http://dbpedia.org/resource/Small_outline_integrated_circuit + , http://dbpedia.org/resource/Surface-mount_technology + , http://dbpedia.org/resource/Consumer_electronics + , http://dbpedia.org/resource/File:Skymaster_DT_500_-_Sharp_GCI_3AV0_-_Philips_TDA6651TT-91794.jpg +
http://dbpedia.org/property/wikiPageUsesTemplate http://dbpedia.org/resource/Template:More_citations_needed + , http://dbpedia.org/resource/Template:Commons_category + , http://dbpedia.org/resource/Template:Semiconductor_packages + , http://dbpedia.org/resource/Template:Short_description + , http://dbpedia.org/resource/Template:Reflist +
http://purl.org/dc/terms/subject http://dbpedia.org/resource/Category:Semiconductor_packages +
http://www.w3.org/ns/prov#wasDerivedFrom http://en.wikipedia.org/wiki/Thin_shrink_small_outline_package?oldid=1105298881&ns=0 +
http://xmlns.com/foaf/0.1/depiction http://commons.wikimedia.org/wiki/Special:FilePath/TSSOP_16L.gif + , http://commons.wikimedia.org/wiki/Special:FilePath/Skymaster_DT_500_-_Sharp_GCI_3AV0_-_Philips_TDA6651TT-91794.jpg +
http://xmlns.com/foaf/0.1/isPrimaryTopicOf http://en.wikipedia.org/wiki/Thin_shrink_small_outline_package +
owl:sameAs http://dbpedia.org/resource/Thin_shrink_small_outline_package + , http://pt.dbpedia.org/resource/Thin-Shrink_Small_Outline_Package + , https://global.dbpedia.org/id/7BGR + , http://www.wikidata.org/entity/Q10382128 + , http://nl.dbpedia.org/resource/Thin_shrink_small_outline_package +
rdfs:comment De thin shrink small outline package (TSSOP) is een rechthoekige kunststof smd IC-behuizing. , Um Thin-Shrink Small Outline Package (ou TUm Thin-Shrink Small Outline Package (ou TSSOP) é um componente retangular de dimensões reduzidas, utilizado em montagem superficial. Um TSSOP Tipo I possui terminais emergindo dos lados mais curtos do componente, enquanto que os TSSOP Tipo II possuem terminais emergindo dos lados mais longos do componente. Um TSSOP pode ter de 8 a 56 terminais.te. Um TSSOP pode ter de 8 a 56 terminais. , The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.
rdfs:label Thin shrink small outline package , Thin-Shrink Small Outline Package
hide properties that link here 
http://dbpedia.org/resource/TSSOP + , http://dbpedia.org/resource/Thin_Shrink_Small_Outline_Package + http://dbpedia.org/ontology/wikiPageRedirects
http://dbpedia.org/resource/TSSOP + , http://dbpedia.org/resource/Mini_Small_Outline_Package + , http://dbpedia.org/resource/Small_outline_integrated_circuit + , http://dbpedia.org/resource/List_of_integrated_circuit_packaging_types + , http://dbpedia.org/resource/Thin_small_outline_package + , http://dbpedia.org/resource/Thin_Shrink_Small_Outline_Package + , http://dbpedia.org/resource/Htssop + http://dbpedia.org/ontology/wikiPageWikiLink
http://en.wikipedia.org/wiki/Thin_shrink_small_outline_package + http://xmlns.com/foaf/0.1/primaryTopic
http://dbpedia.org/resource/Thin_shrink_small_outline_package + owl:sameAs
 

 

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